darcet and Advanced packaging

Advanced packaging refers to combining chips and SMT components into system level packaging (SiP) applications, embedding them into substrate cavities (embedded PCBs), or unfolding the contacts of chips through wafer level fanout (WLFO) or panel level fanout (PLFO) processes. Our goal is to integrate more functions in a smaller space and push them to the market as quickly as possible.

With the increasing demand for smaller IIoT devices, sensors, power modules and medical devices, more and more manufacturers and industries are discovering the potential of this technology and hope that their manufacturing equipment will have higher performance and productivity. Our Darcet advanced packaging solution portfolio plays a very important role in it.