产品中心
产品介绍
• 4 Heads / 4 Tables Bonding System
• ± 2um @ 3σ Accuracy
• Chip Size: 1mm up to 60mm
• Substrate Size: 200mm x 300mm (max)
• Auto Bond Head / Bond Table Tilt Adjustment
• Fluxing: Soaking; Dipping; Dispensing
• Material Input: Wafer (FFC); Die or Interposer on JEDEC Tray/Waffle Pack
• Output Type: Full Substrate; Singulated Substrate on Boat Carrier
• Multi-Layer Bonding Capability
• Product: CoS; IoS; SoC
