覆晶键合机 PHOENIX QuadMaster

产品介绍


• 4 Heads / 4 Tables Bonding System 

• ± 2um @ 3σ Accuracy 

• Chip Size: 1mm up to 60mm 

• Substrate Size: 200mm x 300mm (max) 

• Auto Bond Head / Bond Table Tilt Adjustment 

• Fluxing: Soaking; Dipping; Dispensing

• Material Input: Wafer (FFC);  Die or Interposer on JEDEC Tray/Waffle Pack 

• Output Type: Full Substrate; Singulated Substrate on Boat Carrier 

• Multi-Layer Bonding Capability 

• Product: CoS; IoS; SoC