产品中心
产品介绍
•2 Heads / 2 Tables Bonding System
•± 1.0um @ 3σ Accuracy
•Chip Size: 10mm up to 110mm
•Wafer Size: 12-inch (max)
•Panel Size : 330 x 330mm(Max)
•Auto Bond Head / Bond Table Tilt Adjustment
•Fluxing: Soaking; Dipping; Dispensing
•Configurable To: -Multiple Chip Input -OHT Handler System
•Material Input: Wafer (FFC); Chip on JEDEC/Waffle Pack/TnR
•Output Type: Wafer
•Multi-Layer Bonding Capability
•Product: CoS; CoC; CoW; CoP
