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热压合覆晶键合机
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达仕科技热压键合TCB设备，国内首家已经量产的TCB设备，拥有COS和COW两种量产机型。设备采用模块化设计理念，可以兼容实现FC/CUF/MUF/NCP/NCF/CoWoS等不同热压键合工艺。核心指标达到：多键合头，精度：±1.5um、Chip size：0.5x0.5-110x110(mm)等等。
产品介绍
PHOENIX QuadPro +
•4 Heads / 2 Tables Bonding System
•± 2um @ 3σ Accuracy
•Chip Size: 1mm up to 32mm
•Substrate Size: 160mm x 310mm (max)
•Fluxing: Soaking; Dipping; Dispensing (Optional)
•Material Input: Wafer (FFC); Die or Interposer on JEDEC Tray/Waffle Pack
•Material Output: Full Substrate; Singulated Substrate on Boat Carrier
•Multi-Layer Bonding Capability
•Product: CoS; IoS; SoC
PHOENIX QuadProMX
•4 Heads / 2 Tables Bonding System
•± 1.0um @ 3σ Accuracy
•Chip Size: 0.5mm up to 32mm
•Substrate Size: 330mm x 330mm (max) Or 12” wafer (Max)
•Auto Bond Head and Bond Table Tilt Adjustment
•Fluxing: Soaking; Dipping; Dispensing
•Material Input: Wafer (FFC); Die or Interposer on JEDEC Tray/Waffle Pack
•Output Type: Full Substrate; Singulated Substrate on Boat Carrier
•Multi-Layer Bonding Capability
•Product: CoS; CoW; IoS; SoC
