产品中心
产品介绍
• 8 Heads / 1 Table Bonding System
• ± 3um @ 3σ Accuracy
• UPH : > 10k
• Chip Size: 0.5mm up to 32mm
• Wafer Size : 12-inch Or Panel Size :330x330mm
• Auto Bond Head / Bond Table Tilt Adjustment
• Fluxing: Soaking; Dipping; Dispensing
• Configurable To: -Multiple Chip Input -OHT Handler System
• Material Input: Wafer (FFC); Chip on JEDEC/Waffle Pack/TnR
• Output Type: Wafer
• Multi-Layer Bonding Capability
• Product: CoS; CoC; CoW; CoP
