Products
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Fully automatic silicon wafer invisible cutting equipment: DRT-LS3001
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Stealth Laser-Using infrared light source，SLM multi-focus technique，and RTF real time focus following technology，can realize higher efficiency (over 1.5 times faster than one-focus.) and precision cutting product. (Using different light source, can realize cutting SI, SIC and optical glass, and so on materials.)
产品介绍
Fully automatic silicon wafer invisible cutting equipment: DRT-LS3001
Laser stealth cutting is a cutting technique that focuses the laser on the inside of a silicon wafer, forms a modified layer inside the wafer, and then applies external force to the wafer to divide it into a single chip.
Equipment parameters
◆ Laser: 1064nm-1342nm
◆ Laser power: ≥ 5W
◆ Cooling method: closed cycle water cooling/air cooling
◆ X-axis: stroke 450mm, resolution 0.1um
◆ Y-axis: stroke 500mm, resolution 0.1um
◆ Z-axis: stroke 15mm, resolution 1um
◆ θ Axis: stroke 120 °, resolution 0.0001 °
Scoring speed ≤ 1000mm/s
◆ Scoring size: 6 inches, 8 inches, 12 inches
◆ Multi focus function: optional
Equipment advantages
Multi focus shaping technology for spatial light modulators
◆ High efficiency and non-destructive cutting
◆ Mature process, focus on following technology
