Officially in Production!

"The second of February is the Longtaitou Festival. The dragon raises its head and the weather will be good." Longtaitou has traditionally always been a day of sunshine, and a day for recovery. On this day, Zhejiang Darcet Technology Co., Ltd. officially began production.

Zhejiang Darcet Technology Co., Ltd. moved into the Wuxing District of Huzhou, Zhejiang Province in August 2020. Zhejiang Dashi Technology is a diversified multinational company with cutting-edge technology, 5 locations across the Asia Pacific and a 28-year history in the semiconductor industry. We provide advanced semiconductor packaging equipment such as thermocompression bonding equipment (TBC), stealth, grooving and seamless (Darcet's proprietary technology) laser dicing equipment, turret test-handlers, smart automated packaging lines for fabs and packaging houses, and ultrapure water systems.

THe end of the pandemic added new energy to the construction of Darcet's factory in Zhejiang Province, providing what the Chinese like to call a "red start" for the New Year. Construction of the first and second floors of the factory (production floor areas) was completed successfully. Over 2000 square meters of class 1000 level and class 10000 level cleanrooms, and another 2000 square meters of packaging and testing machine factory space went into production this year.

"On February 2nd, with the arrival of the Longtaitou Festival, both large and small warehouses flow with abundance". On this special occasion, we warmly welcomed investment institutions and government leaders to our company.

Chairman Su Wenhua explained the company's future plans and product performance to various investment institutions in great detail.

Chen Zhide, the General Manager of our company, explained the layout of the company's factory area and the operation of various departments.

Cai Hongjie, director of the management committee of Wuxing District's High tech Zone, paid a visit to our company, delving deep into the intricacies of production, offering valuable suggestions on the future development direction of the company as well as his thoughts on production and operation of companies in general.

In the future, our company will invest further in research and development of new technologies and processes, continuously carry out technological transformation and product innovation, expand market scale, expanding in both scale and increasing in efficiency, ultimately striving to a leading position in the global high-end semiconductor testing and packing equipment industry.