Products
Committed to the research and application of global high-end semiconductor sealing and testing equipment, and the research and application of factory intelligence
Thermal Compression Bonder
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Darcet Technology TCB equipment is the first TCB equipment that has been mass-produced in China, has two mass production models: COS and COW. The equipment adopts a modular design concept, which can be compatible with different hot pressing bonding processes such as FC/CUF/MUF/NCP/NCF/CoWoS. The core indicators are: multi-bonding head, accuracy: ±1.5um, Chip size: 0.5x0.5-110x110 (mm) and so on.
产品介绍
PHOENIX QuadPro +
•4 Heads / 2 Tables Bonding System
•± 2um @ 3σ Accuracy
•Chip Size: 1mm up to 32mm
•Substrate Size: 160mm x 310mm (max)
•Fluxing: Soaking; Dipping; Dispensing (Optional)
•Material Input: Wafer (FFC); Die or Interposer on JEDEC Tray/Waffle Pack
•Material Output: Full Substrate; Singulated Substrate on Boat Carrier
•Multi-Layer Bonding Capability
•Product: CoS; IoS; SoC
PHOENIX QuadProMX
•4 Heads / 2 Tables Bonding System
•± 1.0um @ 3σ Accuracy
•Chip Size: 0.5mm up to 32mm
•Substrate Size: 330mm x 330mm (max) Or 12” wafer (Max)
•Auto Bond Head and Bond Table Tilt Adjustment
•Fluxing: Soaking; Dipping; Dispensing
•Material Input: Wafer (FFC); Die or Interposer on JEDEC Tray/Waffle Pack
•Output Type: Full Substrate; Singulated Substrate on Boat Carrier
•Multi-Layer Bonding Capability
•Product: CoS; CoW; IoS; SoC
