Products
Committed to the research and application of global high-end semiconductor sealing and testing equipment, and the research and application of factory intelligence
Fully automatic laser slotting: DRT-LE3001
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Grooving Laser-Using picosecond light source和SLM multi-focus technique，can realize reducing heat-affected zone, and more flat bottom side, higher efficiency (over 1.5 times faster than one-focus.) and precision grooving. (Suit to Low-k wafer, LCD driver wafer, SIC, GaN and so on product.)
产品介绍
pment parameters
◆ Laser: 532nm green light
◆ Laser power: ≥ 60W
◆ Cooling method: closed circulating water cooling
◆ X-axis: stroke 450mm, resolution 0.1um
◆ Y-axis: stroke 500mm, resolution 0.1um
◆ Z-axis: stroke 15mm, resolution 1um
◆ θ Axis: stroke 120 °, resolution 0.0001 °
◆ Scratch speed ≤ 1000mm/s
◆ Scribe size: 8 inches, 12 inches
◆ Arbitrary switching slot width of spatial light modulator
