Products
Committed to the research and application of global high-end semiconductor sealing and testing equipment, and the research and application of factory intelligence
TCB-PHOENIX DuadPro
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PHOENIX TCB Bonders are also designed and developed for MTD Technology (Melt-&-Touch Down) for high throughput TC Bonding
产品介绍
• 2 Heads / 2 Tables Bonding System
• ± 1.0um @ 3σ Accuracy
• Chip Size: 10mm up to 110mm
• Wafer Size: 12-inch (max)
• Panel Size : 330 x 330mm(Max)
• Auto Bond Head / Bond Table Tilt Adjustment
• Fluxing: Soaking; Dipping; Dispensing
• Configurable To: -Multiple Chip Input -OHT Handler System
• Material Input: Wafer (FFC); Chip on JEDEC/Waffle Pack/TnR
• Output Type: Wafer
• Multi-Layer Bonding Capability
• Product: CoS; CoC; CoW; CoP
