Integrated circuit solutions

1  Grooving Laser-Using picosecond light source和SLM multi-focus technique，can realize reducing heat-affected zone, and more flat bottom side, higher efficiency  (over 1.5 times faster than one-focus.) and precision grooving. (Suit to Low-k wafer, LCD driver wafer, SIC, GaN and so on product.)

2   Stealth Laser-Using infrared light source，SLM multi-focus technique，and RTF real time focus following technology，can realize higher efficiency (over 1.5 times faster than one-focus.) and precision cutting product. (Using different light source, can realize cutting SI, SIC and optical glass, and so on materials.)

3   Seamless Laser-Using DCT patented light source and technology，can replace general blade cutting machine, then realize that no spare parts, no water and non-contact cutting,  nearly zero cutting width, and realize higher efficiency (over 5 times faster than blade cutting for different thickness wafer.）and precision cutting product.