2025年11月13日，由晋江市市政府副市长陈进福带队的晋江市集成电路筹备组一行到浙江达仕科技有限公司调研考察。
陈进福副市长一行参观了公司展厅并听取了目前半导体先进封装领域发展现状的汇报，调研了公司在TCB热压覆晶键合机细分领域的产品和技术成果。陈进福副市长要求公司把握住当前半导体产业自主可控的发展机遇，加强与晋江当地渠梁、晋华等企业的技术合作与产业链协同，为我国高端半导体制造与技术迭代作出更大贡献。
集成电路筹备组一行还参观了达仕科技位于湖州的TCB生产车间，听取了公司应用于HBM芯片键合机、AI芯片键合机等新机型的开发进度。
On 13th November 2025, a preparatory team for Jinjiang’s integrated-circuit initiative, led by Vice-Mayor Chen Jinfu of the Jinjiang Municipal Government, visited Zhejiang Darcet Technology Co., Ltd.
Vice-Mayor Chen and his delegation toured the company’s exhibition hall, received a briefing on the current state of advanced semiconductor packaging, and surveyed Darcet’s products and technical achievements in the niche of TCB (Thermo-Compression Bonding) flip-chip bonders. Vice-Mayor Chen urged the company to seize the present opportunity to achiev self-reliant and controllable development in the semiconductor industry, to strengthen technical cooperation and supply-chain synergy with local Jinjiang firms such as Quliang and Jinhua, and make still greater contributions to China’s high-end semiconductor manufacturing and technology iteration.
The integrated-circuit preparatory team also visited Darcet’s TCB production plant in Huzhou city, where they were briefed on the progress of developing new bonders for HBM chips, AI chips, and other emerging applications.
